API Plans 21 & 23
API Plan 21 |
Recirculation from pump discharge through a flow control orifice and cooler into the seal chamber.
Required Media Characteristic-
Hot, non-polymerizing clean fluids typically less than 176 °C
Fluids with low vapor pressure margin in seal chamber
Fluids with poor lubrication
Not suitable for fluids with high solid content
Feature -
Cool flush is provided to the seal.
This plan is self venting
It reduce coking and improve lubricity
Potential plugging on process side if fluid viscosity rises quickly
API Plan 23 |
Required Media Characteristic-
Clean , non-polymerizing, High temperature fluid, Hot hydrocarbons, Hot water services above 80 °C (176 °F) etc.
Fluid close to vaporization point.
Applications where increasing seal chamber pressure to improve vapor pressure margin is not possible.
Feature -
Product in seal chamber is isolated from rest of pump by throttling bush.
Pumping Ring is used for fluid circulation, It is more efficient than Plan 22
It increase product temperature margin.
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